SUSSMicroTecAG, a German semiconductor inspection device, has developed a new generation of wafer bonding device "ELANCB8". It is characterized by excellent uniformity of pressure and temperature during wafer bonding. In addition to the MEMS field, it also faces the stereoscopic wiring technology that has received much attention recently.
The ELANCB8 controls the uniformity of the pressure applied to the wafer by a technique called "Pressure-Column" at a level of (deviation) of ±5%. If it is a 200mm wafer, a pressure of 90kN can be applied.
In addition, a plurality of distributed heaters can be used to raise the temperature by 30 ° C in one minute. The time required for cooling is also shorter. Temperature uniformity (deviation) is ±1% or less.
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