Graphene film can cool high-power electronic devices



As devices and components become smaller and smaller, in the development of ultra-efficient electronic systems in the future, the dissipation of electrons and optoelectronics is a serious problem. Now, researchers at the Chalmers University of Technology in Sweden have developed a technique for efficiently cooling electronic devices through functionalized graphene nanosheets that may pave the way for this problem. Relevant research results were published in the latest issue of the journal Nature Communications.

In the experiment, the scientists studied a large number of molecules immobilized at the interface and boundary of graphene nano-micro-sheets to form covalent bonds. They also demonstrated the functionally improved thermal coupling phenomenon by using photothermal reflectometry to prove the interface. Thermal resistance. The results show that the heat transfer rate can be improved by more than 76% compared with the untreated system using heat transfer based on different functionalized amino groups and molecular sieves based on azide silane. This is mainly due to the dramatic decrease in contact resistance through the introduction of functionalized molecules. To.
Molecular dynamics simulations and calculations show that the functionalized layer constrains the scattering of low-frequency phonons in the cross-section, but in turn enhances the vertical cross-section heat conduction of the bonded film by restoring the long- curved phonon lifetime. The results show that this electronic device provides a potential thermal management solution.
Professor John Liu, who is engaged in the research of electronic products production at the university, pointed out: “Using graphene nanosheet-based membranes can enable efficient heat transfer for electronics and other electrical equipment. This may be an effective solution, and relevant research results are becoming The nearer the pilot production stage, the future integration of this graphene film into microelectronics and systems for the cooling of high-efficiency light-emitting diodes, lasers, and RF components will enable the development of faster, smaller, energy-efficient and high-efficiency systems. Power electronics pave the way.”

May 13, 2016 Source: Science and Technology Daily

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